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[Report] Global Market for Ball Grid Array (BGA) Packages

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Ball Grid Array (BGA) packages are a type of surface mount package for integrated circuits that can provide more connection terminals compared to dual in-line packages and flat packages. It is important to fully utilize the bottom surface of the device, resulting in shorter wiring between the package and the die, which excels in high-speed performance. Key factors contributing to the growth of the global Ball Grid Array (BGA) packaging market during the forecast period include the growth of the automotive industry and the increasing demand for consumer electronics.

• 企業：グローバルインフォメーション
• 価格：500,000 yen-1 million yen

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